Laser software control system

ABSTRACT

A first software program for simulating an operating laser system controls a processor that generates one or more dummy parameters each corresponding to a parameter of an operating laser system. The dummy parameter is read over a same or similar signal interface as the operating laser system by a processor running a test software subroutine having the laser system parameter as an input. An algorithm including the test software subroutine then generates an output command based on the value of the dummy parameter. A second software program for efficiently scheduling laser service routines based on a predetermined lithography system schedule controls a processor that reads the lithography system schedule including scheduled system downtimes, wherein the scheduled downtimes include start times and durations. The processor then reads a time window and duration for each of one or more scheduled laser service routines. The processor then determines a start time for each scheduled laser service routine within the time window of the service routine, wherein the start times are selected to collectively maximize temporal overlap of the scheduled laser service routine durations and scheduled system downtime durations. A third software program including a flow control kernel controls a processor to receive a unique command from one of multiple external software control programs corresponding to a function of a laser system and input the unique command to the flow control kernel. The flow control kernel outputs a generic command that is the same for each unique input command of the multiple external software control programs corresponding to the same laser system function. The generic command or command sequence is then input to a generic control module corresponding to the laser system function.

PRIORITY

This application claims the benefit of priority to U.S. Provisionalpatent application No. 60/186,011, filed Mar. 1, 2000.

BACKGROUND

1. Field of the Invention

The invention relates to laser software control systems and software,and particularly to a control system that facilitates laser controlsoftware development for R & D stage lasers, increases laser systemuptimes and reduces control system software development time and costs.

2. Discussion of the Related Art

Semiconductor manufacturers are currently using deep ultraviolet (DUV)lithography tools based on KrF-excimer laser systems operating around248 nm, as well as the following generation of ArF-excimer laser systemsoperating around 193 nm. Vacuum UV (VUV) will use the F₂-laser operatingaround 157 nm.

The short wavelengths are advantageous for photolithography applicationsbecause the critical dimension (CD), which represents the smallestresolvable feature size producible using photolithography, isproportional to the wavelength. This permits smaller and fastermicroprocessors and larger capacity DRAMs in a smaller package. The highphoton energy (i.e., 7.9 eV) is also readily absorbed in high band gapmaterials like quartz, synthetic quartz (SiO₂), Teflon (PTFE), andsilicone, among others, such that the excimer and molecular fluorinelasers have great usefulness presently and even greater potential in awide variety of materials processing applications.

Higher energy, higher efficiency excimer and molecular fluorine lasersare being developed as lithographic exposure tools for producing verysmall structures as chip manufacturing proceeds into the 0.18 micronregime and beyond. Making smaller chips faster involves synchronisticimprovements in silicon processing, imaging systems and the radiationexposure sources (the lasers). Specific characteristics of laser systemssought to be improved upon in accord with these goals particularly forthe lithography market include higher repetition rates, increased energystability and dose control, increased percentage of system uptime,narrower output emission linewidths, improved wavelength calibration,and improved compatibility with stepper/scanner imaging systems.

Various components and tasks relating to today's lithography lasersystems are increasingly designed to be computer- orprocessor-controlled. The processors are programmed to receive variousinputs from components within the laser system, and to signal thosecomponents and others to perform adjustments such as gas mixturereplenishment, discharge voltage control, burst control, alignment ofresonator optics for energy, linewidth or wavelength adjustments, amongothers, and adjustments having to do with interfacing with the imagingsystem.

Many of the control procedures that the processors of these lasersystems are involved in are “feedback” subroutines. That is, a parameteris monitored and the same or a different parameter is controlled byprocessor commands to system components based on the value of themonitored parameter. Often the processor commands that control thecontrolled parameter also affect the monitored parameter, they are thesame parameter, and thus the feedback subroutines are continuouslymonitoring and adjusting the system.

It is recognized in the present invention, that there is a difficultywith developing software control programs particularly for feedbacksubroutines for use with laser systems that are still in the R & D stageand not yet fully operational. That is, input parameters cannot bereceived by the processor from a fully operational laser system, whichis the intended purpose of the feedback control software beingdeveloped, until a working laser is actually up and running. At the sametime, it presents an undesirable delay in the marketing of new, improvedlasers when software development for the processor control of the newlasers is undertaken only after the laser hardware package is otherwisefully developed. It is desired to have a way to develop processorcontrol software for next generation industrial lasers in parallel withthe development of the lasers themselves.

Both the chip production processing and the operation of the lasersystem require some specifically ascribed downtime periods. For the chipprocessing, maybe the masks or reticles need to be aligned or changed,the substrate sheets changed or the imaging optics adjusted. For thelaser system, maybe a new gas fill or partial gas replacement, orscheduled service on the optics or electrical system is required, orbeam alignment or wavelength calibration requiring some offlineservicing is expected.

The imaging system and/or chip manufacturer typically informs the lasermanufacturer what the processing schedule (time schedule for periods ofexposure and non-exposure, or uptimes and downtimes) will be for aparticular customer order. It is recognized in the present inventionthat both the laser system and chip processing downtime periods workagainst the overall goal of maximizing the uptime of the overall system.While some downtime may be unavoidable due to scheduled or unexpectedservicing needs of the system, it is desired to have a system where onlythe minimum amount of downtime is incurred for scheduled servicing ofthe system.

Each customer who orders a lithography laser system typically supplies alist of commands or command sequences corresponding to various functionsrequired of the laser that are input to the control processor of thelaser from an external controller, e.g., at the fab. Each customertypically assigns a different command or command sequence to commonfunctions of the laser system. Software packages including unique lasercontrol modules for each different customer's command/command sequencelist are conventionally created consuming a large amount of softwaredevelopment time and cost. It is desired to reduce this softwaredevelopment time and cost.

SUMMARY OF THE INVENTION

It is therefore a first object of the invention to provide a softwaredevelopment technique wherein processor control software for nextgeneration industrial lasers may be developed while the lasersthemselves are being developed.

It is a second object of the invention to provide a photolithographicprocessing system wherein a reduced amount of downtime is incurred forscheduled servicing of the system.

It is a third object of the invention to reduce the time and cost ofdeveloping processor control software for photolithographic processingsystems.

In accord with the first object, a method and software program forsimulating an operating laser system is provided in accord with a firstaspect of the invention. The program generates one or more dummyparameters each corresponding to a parameter of an operating lasersystem. The dummy parameter is read over a same or similar signalinterface as the operating laser system by a processor running a testsoftware subroutine having the laser system parameter as an input. Analgorithm including the test software subroutine then generates anoutput command based on the value of the dummy parameter. The dummyparameter is preferably closely estimated to be the value of the lasersystem parameter to which it corresponds. The algorithm having the lasersystem parameter as an input may be advantageously developed and testedseparately from the operating laser system.

In accord with the second object, a method and software program forefficiently scheduling laser service routines based on a predeterminedlithography system schedule is provided in accord with a second aspectof the invention. A processor reads the lithography system scheduleincluding scheduled system downtimes, wherein the scheduled downtimesinclude start times and durations. The processor then reads a timewindow and duration for each of one or more scheduled laser serviceroutines. The processor then determines a start time for each scheduledlaser service routine within the time window of the service routine,wherein the start times are selected to collectively maximize temporaloverlap of the scheduled laser service routine durations and scheduledsystem downtime durations. The processor then writes a start time foreach scheduled laser service routine.

In accord with the third object, a software program is providedincluding a flow control kernel in accord with a third aspect of theinvention. A command or command sequence unique to one of multipleexternal software control programs corresponding to a function of alaser system is read and input to the flow control kernel. The flowcontrol kernel outputs a generic command or command sequence that is thesame for each unique input command or command sequence of the multipleexternal software control programs corresponding to the same lasersystem function. The generic command or command sequence is then inputto a generic control module corresponding to the laser system function.The kernel may include a universal translator or translator table.Advantageously, only one set of generic control modules may be used withall of the multiple external software control programs.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 schematically illustrates an operating excimer or molecularfluorine laser system.

FIG. 2 schematically illustrates a laser control computer connected to asecond computer running laser simulation software in accord with a firstembodiment.

FIG. 3 illustrates a laser service routine schedule written to minimizelithography system downtime in accord with a second embodiment.

FIG. 4 illustrates the flow control kernel that receives unique customercommands and outputs generic laser system control commands in accordwith a third embodiment.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 1 schematically shows a laser system in accord with a preferredembodiment. The system includes a laser chamber 2 filled with a gasmixture and having a pair of main electrodes 3 and one or morepreionization electrodes (not shown). The electrodes 3 are connected toa solid-state pulser module 4. A gas handling module 6 is connected tothe laser chamber 2. A high voltage power supply 8 is connected to thepulser module 4. A laser resonator is shown including the laser chamber2 and a rear optics module 10 and a front optics module 12. An opticscontrol module 14 communicates with the rear and front optics modules10, 12. A computer or processor 16 controls various aspects of the lasersystem. A diagnostic module 18 receives a portion of the output beam 20from a beam splitter 29.

The gas mixture in the laser chamber 2 typically includes about 0.1% F₂,1.0% Kr and 98.8% Ne for a KrF-laser, 0.1% F₂, 1.0% Kr and 98.8% Neand/or He for an ArF laser, and 0.1% F₂ and 99.9% Ne and/or He for a F₂laser (for more details on the preferred gas mixtures, see U.S. Pat.Nos. 4,393,505, 4,977,573 and 6,157,162 and U.S. patent application Ser.Nos. 09/447,882, 09/418,052, 09/688,561, 09/416,344, 09/379,034,09/484,818 and 09/513,025, which are assigned to the same assignee asthe present application and are hereby incorporated by reference). Thelaser system may be another gas discharge laser such as a KrCl, XeCl orXeF excimer laser. A trace amount of a gas additive such as xenon, argonor krypton may be included (see the '025 application, mentioned above).

One or more beam parameters indicative of the fluorine concentration inthe gas mixture, which is subject to depletion, may be monitored, andthe gas supply replenished accordingly (see the applications mentionedabove). The diagnostic module 18 may include the appropriate monitoringequipment or a detector may be positioned to receive a beam portionsplit off from within the laser resonator (see the '052 application).The processor 16 preferably receives information from the diagnosticmodule 18 concerning the halogen concentration and initiates gasreplenishment action such as micro-halogen injections, mini and partialgas replacements, and pressure adjustments by communicating with the gashandling module 6.

Although not shown, the gas handling module 6 has a series of valvesconnected to gas containers external to the laser system. The gashandling module 6 may also include an internal gas supply such as ahalogen and/or xenon supply or generator (see the '025 application). Agas compartment (not shown) may be included in the gas handling module 6for precise control of the micro halogen injections (see the '882application, mentioned above, and U.S. Pat. No. 5,396,514, which isassigned to the same assignee as the present application and is herebyincorporated by reference).

The wavelength and bandwidth of the output beam 20 are also preferablymonitored and controlled. Preferred wavelength calibration apparatusesand procedures are described at U.S. Pat. Nos. 6,160,832 and 6,160,831,which are hereby incorporated by reference. The monitoring equipment maybe included in the diagnostic module 18 or the system may be configuredto outcouple a beam portion elsewhere such as from the rear opticsmodule 10, since only a small intensity beam portion is typically usedfor wavelength calibration (see the '344 application).

Preferred main electrodes 3 are described at U.S. patent applicationSer. No. 09/453,670, which is assigned to the same assignee as thepresent application and is hereby incorporated by reference. Otherelectrode configurations are set forth at U.S. Pat. Nos. 5,729,565 and4,860,300, which are hereby incorporated by reference. Preferredpreionization units are set forth at U.S. patent application Ser. Nos.09/692,265 and 09/247,887, which are assigned to the same assignee asthe present application and are hereby incorporated by reference. Thepreferred solid state pulser module 4 and the high voltage power supply8 are set forth at U.S. Pat. Nos. 6,020,723 and 6,005,880 and U.S.patent application Ser. No. 09/640,595, which are assigned to the sameassignee as the present application and are hereby incorporated byreference into the present application.

The resonator includes optics for line-narrowing and/or line-selectionand also preferably for further narrowing the selected line. Manyvariations are possible for this purpose, those shown in U.S. Pat. Nos.4,399,540, 4,905,243, 5,226,050, 5,559,816, 5,659,419, 5,663,973,5,761,236, 6,081,542, 6,061,382, and 5,946,337, and U.S. patentapplication Ser. Nos. 09/317,695, 09/130,277, 09/244,554, 09/317,527,09/073,070, 09/452,353, 09/602,184, 09/629,256, 09/599,130, 60/170,342,60/172,749, 60/178,620, 60/173,993, 60/166,277, 60/166,967, 60/167,835,60/170,919, 60/186,096, each of which is assigned to the same assigneeas the present application, and U.S. Pat. Nos. 5,095,492, 5,684,822,5,835,520, 5,852,627, 5,856,991, 5,898,725, 5,901,163, 5,917,849,5,970,082, 5,404,366, 4,975,919, 5,142,543, 5,596,596, 5,802,094,4,856,018, 5,970,082, 5,978,409, 5,999,318, 5,150,370 and 4,829,536, andGerman patent DE 298 22 090.3, are each hereby incorporated by referenceinto the present application. Some of the line selection and/or linenarrowing techniques set forth in these patents and patent applicationsmay be used in combination.

The processor 16 is also shown connected to an interface 24. Theinterface 24 allows the processor 16 to communicate with astepper/scanner computer 26 associated with the imaging system. Theinterface 24 also allows the processor 16 to communicate with controlunits 28 at a hand held terminal, also associated with the imagingsystem or otherwise at the fab.

As shown in FIG. 1, the processor 16 receives various inputs atinterfaces labeled 21-26. The processor 16 may receive many other inputsand may not receive all of the inputs at interfaces 21-26 as showndepending on the configurational specifications of the laser system. Inaddition, some of the modules may communicate directly with each other,e.g., some of the modules may be configured with their ownmicroprocessors. The processor shown at FIG. 1 is limited to receivinginputs at interfaces 21-26 for the purposes of illustrating theadvantages of the preferred embodiment.

Input at interface 21 to the processor 16 is received from the powersupply 8. Input at interface 22 is received from the gas handling module6. Input at interface 23 is received from the optics control module 14.Input at interface 24 is received from the diagnostic module 18. Inputat interface 25 is received from the pulser module 4. Input at interface26 is received from the interface 24 connected to the stepper/scannercomputer 26 and control units 28 of the fab.

During operation of the laser system shown at FIG. 1, the processor 16receives the inputs at interfaces 21-26 and sends control signals out tovarious modules based on the inputs received at interfaces 21-26. Theprocessor 16 may send signals out to the power supply 8 throughinterface 21, to the gas handling module 6 through interface 22, to theoptics control module 14 through interface 23, to the diagnostic module18 through interface 24, to the pulser module 4 through interface 25,and to the interface 24 through interface 26. In this way, the processor16 monitors and controls various modules of the laser system.

As stated above, a problem arises when there is no laser systemavailable to receive inputs through interfaces 21-26, even though it isdesired to test and run software for controlling the processor 16. Theproblem may arise when the laser system is still under development, orwhen an operating laser system that has been developed is simply notavailable for connecting the processor 16 through the various interfaces21-26 to the various modules of the laser system, as shown in FIG. 1.

FIG. 2 shows a processor 16 connected to a simulation computer 30through the same interfaces 21-26 shown and described at FIG. 1. Thesimulator computer 30 is configured for and is connected to theprocessor 16 through interfaces 21-26, just as the various componentmodules of the laser system would be connected in accord with FIG. 1. Asfar as the processor 16 is concerned, the processor 16 is connected atthe same interfaces 21-26 as it would be if it were connected into afully operational laser system, such as that schematically shown at FIG.1.

The simulator computer 30 is equipped with software including a softwareprogram for simulating an operating laser system, such as the oneschematically shown at FIG. 1, in accord with the first aspect of theinvention. The simulator program generates one or more dummy parameterseach corresponding to a parameter of the operating laser system. Thedummy parameters are sent to the processor 16 from the simulatorcomputer 30 over the same interfaces 21-26 that the component modules ofthe laser system of FIG. 1 would if the processor 16 were connectedthereto. The dummy parameters are received and read by the processor 16which is running a test software subroutine having the laser systemparameters corresponding to the dummy parameters as inputs. As such, thedummy parameters have preferably the same or similar values as the lasersystem parameters that the component modules of the laser system wouldsend to the processor 16, again if the processor 16 were connected inthe laser system according to FIG. 1.

The software loaded on the processor 16 processes the dummy parametersjust as the processor 16 would process corresponding laser systemparameters. The processor 16 then generates and sends output commandsbased on the values of the dummy parameters through the interfaces 21-26to the simulator computer 30. The simulator computer 30 is preferablyequipped to receive, store and/or display the generated output commandsand/or the effect on a simulated laser system that the output commandswould have just as if the output commands were issued to the variousmodules of an operating laser system. The algorithm having the lasersystem parameter as an input may be advantageously developed and testedseparately from the operating laser system.

FIG. 3 illustrates a second embodiment wherein a laser service routineschedule is written to minimize lithography system downtime. A timelineis shown depicting various time durations including lithography systemuptimes U1-U5, and downtimes D1-D3 and X1-X2. The timeline also showsthe start times S1-S3 of the downtimes D1-D3, and the start time S0 ofthe lithography processing. The timeline is a continuously running timefrom the start time S0 representing the start of lithography processing,e.g., with a new project. Each of the times U1-U5, D1-D3 and X1-X2 alongthe timeline represent durations of time during the ongoing lithographyprocessing according to states of the processing. The various durationsdepicted in FIG. 3 are not drawn to a realistic scale and are onlydepicted to illustrate this embodiment.

The uptimes U1-U5 represent time durations when chips are actually beingexposed by the laser. The downtimes D1-D3 and X1-X2 represent timedurations when chips are not being exposed by the laser. The downtimesD1-D3 are scheduled downtimes of the lithography system not having to dowith scheduled service of the laser system, and are determined at thefab. As mentioned above, the timeline including the uptimes U1-U5 andthe downtimes D1-D3 are communicated to personnel associated with thelaser system in advance by personnel at the fab or otherwise associatedwith the lithography system. The downtimes X1-X2 are imposed on thelithography system due to unavoidable scheduled servicing of the lasersystem that could not be scheduled during scheduled downtimes D1-D3 ofthe lithography system.

Scheduled laser service routines are depicted as labeled (a)-(d) in FIG.3. These scheduled laser service routines are temporally located tocorrespond to times along the timeline when laser service routines areto be performed. The durations W1-W4 are windows of time anywhere withinwhich the scheduled service associated with the laser service routines(a)-(d), respectively, could be started. The durations D1′-D4′ are thetemporal durations of the scheduled laser service routines (a)-(d),respectively, or the time it takes to perform the scheduled laserservice routines (a)-(d). The windows W1-W4 and the durations D1′-D4′are set in advance and are constraints on the real laser system (ideallythey would not exist).

Each of the lithography system uptimes U1-U5, the downtimes D1-D3 of thelithography system not having to do with scheduled service of the lasersystem, the windows W1-W4 and the durations D1′-D4′ are inputs to aprocessor running a computer program in accord with the second aspect ofthe invention. The program computes the start times S1′-S4′ according toits programming. The windows W1-W4 and the durations D1′-D4′ may beadjustable depending on their relative values, and the program takesthat into consideration in its determination of the start times S1′-S4′.The start times S1′-S4′ are advantageously determined by the programsuch that the downtimes (i.e., X1, X2, etc.) associated with scheduledservice of the laser system that could not be scheduled duringlithography system downtimes D1-D3 are minimized. It follows that theoverall uptime of the lithography system (i.e., U1+U2+U3+U4) isadvantageously maximized along the entire timeline shown in FIG. 3.

The scheduled service routine (a) is advantageously scheduled to overlapentirely within the scheduled lithography system downtime D1. In thiscase, there is no downtime incurred due to the laser system serviceroutine (a). The scheduled service routine (a) shows the start time S1′being set such that the scheduled service of the laser system isfinished right about or just before the time the lithography systemdowntime D1 is ended and the lithography system is previously scheduledto be brought back up. The position of the start time S1′ and thus thelaser service duration D1′ of the laser service routine (a) within thelithography system downtime duration D1 in this case may have beendetermined based on how other windows Wi may adjust depending on whenthe service routine (a) is completed. Again, the total schedule is setto minimize the total downtime incurred by the overall system due solelyto scheduled laser system servicing.

The scheduled service routine (b) is unavoidably scheduled within apreviously scheduled uptime of the lithography system. The programdetermined that there was no scheduled lithography system downtime D1-D3within which the laser service routine (b) could have been performed.The start time S2′ was nonetheless selected based on how future windowsWi and start times Si′ would be affected by its positioning along thetimeline to maximize total uptime of the system.

The third laser service subroutine (c) is, like routine (a),advantageously entirely overlapped with lithography system downtime D2.The duration D3′ extends beyond the window W3, but the start time S3′ iswithin the window W3, which is all that is required regarding thepositioning of the duration D3′ relative to the window W3, beyondminimizing the downtimes Xi.

The fourth laser service routine (d) shown in FIG. 3 overlaps the entiresystem downtime D3, as the start time S3 of the downtime D3 is at thestart time S4′ of the laser service duration D4′. However, the durationD4′ is longer than the duration D3, and so downtime X2 was unavoidable.However, the selection of the start time S4′ at the start time S3 ratherthan after S3 resulted in a shorter downtime X1. The start time S4′ wasnot selected to be earlier than S3 because the overall sum of downtimesXi was minimized by selecting that start time S4′, even though settingS4′ somewhat earlier time would not have reduced the overall downtime Xiassociated directly to the laser service routine (d).

FIG. 4 illustrates a flow control kernel 32 in accord with a thirdembodiment that receives unique customer commands from a unique customerI/O 34 and that vary depending on the customer. The kernel 32 outputsgeneric laser system control commands to generic control modules 36. Asdiscussed above, unique control modules are conventionally created foreach set of unique customer commands input from customer I/O 34.Advantageously, only a single set of generic control modules 36 areshown in FIG. 4 that may be used for any of multiple unique sets ofcustomer commands or command sequences input from customer I/O 34.

The flow control kernel 32 advantageously converts the unique customercommands received from the customer I/O 34 into generic commands. Thegeneric commands generated by the kernel from the unique commands itreceives correspond to a laser function. The laser function iscontrolled by the generic modules 36. For example, one generic module 36could be a laser safety module 36 a such as might control a shutter.Other generic modules 36 might include a gas control module 36 b, aterminal I/O module 36 c, a wavelength (WL) control module 36 d, anenergy control module 36 e, a temperature control module 36 f and/or aburst control module 36 g. The generic modules 36 control laserfunctions causing a shutter to close, the power to be turned up, a gasaction to be performed, the wavelength to be adjusted, etc.

Advantageously, the kernel 32 is programmed to understand any command itmight receive from the customer I/O unique to the particular customerinvolved. The kernel 32 may translate the commands using a universaltranslator or the kernel 32 may refer to a translation table of havingeach of the unique commands it may receive from the customer I/Ocorresponding to the generic command the kernel 32 is to send to theparticular generic control module 32 a-32 g that deals with thatparticular generic command. Advantageously, software development timeand costs are reduced according to the third aspect of the invention.

The objects of the invention are thus met. The laser simulation softwareprogramming loaded onto the simulator computer that is connected to theprocessor 16 through interfaces 21-26 as shown and described withrespect to FIGS. 1-2 advantageously permits processor control softwarefor next generation industrial lasers to be developed while the lasersthemselves are being developed. The laser service scheduling programshown and described with respect to FIG. 3 advantageously minimizeslithography system downtimes and therefore maximizes lithography systemuptime. The flow control kernel 32 shown and described with respect toFIG. 4 advantageously reduces laser control processor softwaredevelopment time and costs.

Those skilled in the art will appreciate that the just-disclosedpreferred embodiments are subject to numerous adaptations andmodifications without departing from the scope and spirit of theinvention. Therefore, it is to be understood that, within the scope andspirit of the invention, the invention may be practiced other than asspecifically described above, and the invention is not to limited by anydescription of the preferred embodiments, but is defined by the languageof the appended claims, and structural and functional equivalentsthereof.

1. A system for simulation of the operation of a laser system, andtesting an operation of a laser control processor, the system including:a simulation processor programmed to generate one or more dummyparameters each corresponding to a parameter of an operating lasersystem; an interface coupled to the simulation processor, which providesfor transmitting a signal including data corresponding to said one ormore dummy parameters from the simulation processor; a laser controlprocessor coupled to the simulation processor, through the interface,the laser control processor being programmed to receive the signal anduse the one or more dummy parameters as input parameters which simulatean operating laser system, wherein the laser control processor operatesto generate control signals based on the one or more dummy parameters.2. The system of claim 1, wherein the simulation processor is programmedsuch that said one or more dummy parameters simulate operationalparameters which would be generated in actual operation of the lasersystem.
 3. In an industrial processing system which includes a lasersystem, a method for scheduling laser service routines based on anindustrial processing system operating schedule the method including:providing a processor which is programmed to schedule an execution oflaser service routines, wherein the processor operates to perform thesteps of: reading the industrial processing system schedule includingscheduled system uptimes and downtimes including start times anddurations of said uptimes and downtimes; reading a time window andduration for each of one or more scheduled laser service routines;calculating a start time for each scheduled laser service routine withinthe time window of the service routine, wherein the start times areselected to collectively maximize temporal overlap of the scheduledlaser service routine durations and scheduled industrial processingsystem downtime durations; and outputting the calculated start times. 4.The system of claim 3, wherein the processor performs the further stepof writing a start time for each scheduled laser service routine.
 5. Alaser system having a processor for controlling operation of differentcomponents of the laser system, wherein the processor is programmed toperform the following method: reading a command unique to one ofmultiple external software control programs corresponding to a functionof a laser system, each of said multiple external software controlprograms having a unique command corresponding to the function of thelaser system; processing said command according to a flow control kernelto determine a generic command corresponding to said command, whereinsaid generic command is the same for each unique command of the multipleexternal software control programs; and outputting said generic command.6. The system of claim 5, wherein the processor performs the furtherstep of inputting the generic command to a generic control modulecorresponding to the laser system function.
 7. The system of any ofclaim 5 or 6, wherein the flow control kernel includes a universaltranslator.
 8. The system of any of claim 5 or 6, wherein the flowcontrol kernel includes a translator table.
 9. The system of claim 6,wherein the same generic control module is used for each of said uniquecommands corresponding to said multiple external software controlprograms.